Manufacture of multilayer wiring

Abstract

Abstract PURPOSE:To connect wirings mutually and excellently by forming a first wiring layer with a projecting section on a substrate, forming an insulating film on the first wiring layer so that the upper surface of the projecting section is exposed and forming a second wiring layer on the projecting section. CONSTITUTION:The first wirings 510-530 are formed on the substrate 1, to which a semiconductor element is formed, by lift-off technique through an insulating film 2. Each wiring 510-530 is constituted by first layers 511-531 consisting of aluminum, second layers 512-532, etching rates thereof are slower than aluminum, and third layers 513-533 consisting of aluminum. Sections except the first wirings 510-530 are removed, the third layers 513, 533 except connecting sections with the second wiring layers are removed, and the projecting first wiring layer 520 is formed. The insulating layer 8 is formed on the first wiring layer 520 so that the surface of the projecting layer 520 is exposed, and the second wiring layer 9 is formed so as to be connected to the projecting layer 520.

Inventors

• 👤 Nobuo Owada
• 👤 伸郎 大和田
• 👤 Michio Yamashita
• 👤 道男 山下
• 👤 Osamu Kasahara
• 👤 修 笠原
• 👤 Hideki Tomioka
• 👤 富岡　秀起

Bibliographic Details