Semiconductor substrate

Abstract

Abstract PURPOSE:To make masking adjustment easy and at the same time the absolute value evaluation of the masking adjustment accuracy possible by providing recesses on four positioning edges of a substrate positioning mark corresponding to a cross-shape positioning mark. CONSTITUTION:A positioning mark 2 of a semiconductor substrate is a square and the length a of its side is longer than the width b of a protruded part of a cross-shape positioning mark 1. A recess positioning edge is provided to each side of the square where the protruded part of the cross-shape positioning mark 1 is set. The dimensions (d), (e), (f) of the concave is determined in accordance with the required accuracy for masking adjustment and f-e is the value of the adjustment accuracy. When a is not less than 30mum and b is not less than 10mum, the resolution of the view at the masking adjustment is improved and the adjustment accuracy of 1.0mum can be realized. As the valve f-e of the concave is known beforehand, the absolute value of the adjustment discrepancy can be evaluated at the same time.

Inventors

• 👤 Kazuo Endo
• 👤 遠藤　和夫
• 👤 Takashi Kimura
• 👤 隆 木村

Bibliographic Details