Manufacture of resin sealed type semiconductor device

Abstract

Abstract PURPOSE:To securely perform coating by a method wherein a supporting body with a semiconductor chip mounted is cut in the neighborhood of a package structural resin, and then a resin element material is attached at the cut part, thus being gelatinized and heat-hardened. CONSTITUTION:The metallic supporting bodies wherein the semiconductor chip is fixed in the epoxy series package resin body 3 are joined to frames 7 and 8 by means of external leads 4 and fixing filaments 5. A solid epoxy resin pellet 6 is mounted at the cut part of the conductive filaments 5 and then heated at 50- 100 deg.C with an infrared ray lamp by arranging the body on a mount base 9. At this time, the pellet 6 gelatinizes and covers the cut part 5. Next, when the body is passed through a furnace kept at 120-200 deg.C, resin hardening is promoted, and the cut part being covered into secure solidification. When the fluidity is sufficiently controlled at the stage of gelatinization by using a resin sealing material of the same composition as the package resin body, sealing can be securely performed with stable quality without the strain between the resins.

Inventors

• 👤 Hitoshi Kita
• 👤 北　仁志
• 👤 Kenichi Tateno
• 👤 立野　健一
• 👤 Masami Yokozawa
• 👤 横沢　真覩

Bibliographic Details