Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To prevent the generation of burrs in the periphery of a heat dissipating part and thus contrive to improve the moisture resistance by a method wherein the top end of a hold pin which presses the heat dissipating part of a package is formed in drill top form. CONSTITUTION:The top end 8A of the hold pin 8 is formed in drill form and pressed by a plate 9 via a spring 14. A heat dissipating plate 4A is pressed on the lower metal mold 1 elastically according to the dispersion of the thickness. When a mold resin is cast into a cavity sealing metal molds 1 and 2 make in this state, the area of the heat dissipating plate 4A in contact with moisture equals to a point, therefore the infiltration of moisture from a hole 13 into the package 12 can be satisfactorily blocked. Then, burrs do not generate in the periphery because of the firm press of the heat dissipating plate 4A, and deburring is unnecessitated. Besides, a hole 15 penetrates through the package 12, and is used for inserting a set screw.

Inventors

• 👤 Shiro Oi
• 👤 大居　四良

Bibliographic Details