Resin seal type semiconductor device

Abstract

Abstract PURPOSE:To improve the heat dissipation efficiency and the mass productivity by a method wherein a concave and convex part for heat dissipation is formed into one body with a package by a plastic mold. CONSTITUTION:When a cap 5 is formed by resin sealing using a metal mold in the manufacturing process of a resin seal type semiconductor device of DIP package 1, the cap 5 of the package 1 is formed by feeding the metal mold preliminarily formed of grooves 7 with plastic resin and the like. Through these procedures, a heat sink with concave and convex part for heat dissipation is formed into one body with the package 1 by resin sealing. The heat sink 2 may be formed with the grooves 7 as many and as deep as possible to improve the heat dissipation efficiency.

Inventors

• 👤 Jiyunya Amashiro
• 👤 天白　順也

Bibliographic Details