Production of ni stamper

Abstract

Abstract PURPOSE:To obtain a stamper which excels in transcription performance by producing a master disk without using photoresist and applying an Au film in lien of an Ag film to the master disk. CONSTITUTION:A metallic target of a low fusing point of Te is used on a glass substrate 21, and the reactive sputtering is carried out in a gaseous mixture of Ar and CH4. As a result, a Te-C-H reactive thin film containing C and H is formed in a Te thin film. A laser is exposed to the Te-C-H thin film to form a groove of a continuous spiral projected pattern, and a master disk 25 containing a micropattern layer 22. Then an Au or Au alloy film is formed on the layer 22 by a sputtering or electron beam vapor deposition process. Thus a coated layer 23 having 200-1,500Angstrom thickness needed for Ni electrodeposition is formed, and an Ni layer 24 of 200-300mum is formed on a conductive film by an Ni electrodeposition process. This layer 24 is separated from the disk 25 to obtain a stamper to which a micropattern is transcribed.

Inventors

• 👤 Norio Ozawa
• 👤 小沢　則雄
• 👤 Akio Hori
• 👤 昭男 堀
• 👤 Noburo Yasuda
• 👤 安田　修朗
• 👤 Takashi Koizumi
• 👤 隆 小泉

Bibliographic Details