JPS5958833A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Shinkawa Ltd
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Filing: 1982-09-28
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Granted: —
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Expires: 2002-09-28
Abstract
Abstract PURPOSE:To obtain a strong connection by selectively plating the wire connecting section of a lead frame made of Cu or Cu group alloy or Fe or an Fe group alloy with Cu. CONSTITUTION:The surface of base material itself made of Cu or a Cu group alloy or Fe or an Fe group alloy is hard, but its surface is changed into a soft material when the base material is plated with Cu. Since a wire is connected to the soft material section, adhesive strength is increased and the wire is not exfoliated, and the oxidation of the surface is prevented and connection is strengthened.
Inventors
- 👤 Tomio Kobayashi
- 👤 十三男 小林
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-06 01:17
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5525; H10W72/555; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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