Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To contrive improvement in yield rate and reduction in cost of the titled device by a method wherein a connection part is provided in the interior of an element and an acceptable element is connected to said connection part, thereby a defective element is remedied. CONSTITUTION:As an example of design, connection pads 1 and 2 are provided on both sides of the split part 5 determined by functional dividing, and an element splitting region 3 is provided between them. At this time, the wiring 4 corresponding to the conventional wiring 4' is wired within the element splitting region. Also, the functional elements located on both end parts of the wiring are reconstituted to cope with the situation wherein a connection terminal is added and the load capacity is increased when the element is remedied. An example is given for a defective element to be remedied as follows. As shown in the diagram (A), the split part 11 of the defective element is selected on a wafer, and then its wiring is cut inside the connection terminal using a laser. The element shown in the diagram (B) is cut by performing a dicing in the split region, and a non-defective part 11' corresponding to the defective part of the element shown in the diagram (A) is prepared. The element shown in the diagram (A) is connected to a tape carrier, and when the non-defective article part of the element shown in the diagram (B) corresponding to the defective part of the element is connected, the element shown in the diagram (C) having the function same as the non-defective article can be obtained.

Inventors

• 👤 Kuniya Satou
• 👤 佐藤　圀彌

Bibliographic Details