Mounting system of large scale integration

Abstract

Abstract PURPOSE:To facilitate a mounting to the same signal pattern while simplifying repair work such as the exchange of defectives, and to increase mounting density by separately mounting the LSIs, in which terminals are arranged in the relationship of a mirror inversion, to the surface and back of a surface board. CONSTITUTION:LSI Chips 2, 3, etc. are directly bonded with the surface and back of a substrate 1. The terminals 6 and 7 of th chip 3 are disposed to the terminals 4 and 5 of the chip 2 to form the relation-ship of the mirror inversion at that time. That is, the LSIs are constituted so that the terminals 4 and 7, 5 and 6 function similarly. Consequently, only through-holes 12 may be formed when signal patterns 10 and 11 formed to the substrate 1 on the chip 3 side corresponding to signal patterns 8 and 9 formed to the substrate 1 on the chip 2 side are connected to the signal patterns 8 and 9. Accordingly, the signal patterns are not complicated, mounting density is increased, and the chips are also exchanged easily.

Inventors

• 👤 Yoshio Okajima
• 👤 良男 岡嶋
• 👤 Toru Yamashita
• 👤 徹 山下

Bibliographic Details