Wire bonding device

Abstract

Abstract PURPOSE:To prevent the generation of poor short circuits due to the thermal deformation of bonding wires and improve the characteristic of a body to be bonded by locally heating only a bonding region by means of laser irradiation. CONSTITUTION:A lead frame 22 is supplied at a fixed position of the bonding part 20, and then a bonding head 25 is lowered so that a laser irradiation port 28 becomes opposed to a bonding point 30. Heat treatment is performed by supplying laser from a laser generator 27 to a laser irradiated part 24 via a laser supply tube 26 and then irradiating the part. The bonding wire 29 is led out from a capillery tool 23 and applied to thermo compression bonding. Since the bonding wire 29 is thermo compression bonded by heating directly only the bondig point 30 by means of laser irradiation, the entire body of a semiconductor pellet 21 is not heated, and thus the positional slippage of the semiconductor pellet 21 can be blocked, and the deterioration of characteristics due to heating can be prevented.

Inventors

• 👤 Minoru Kagino
• 👤 鍵野　実

Bibliographic Details