Resin sealed type semiconductor device

Abstract

Abstract PURPOSE:To cut down the parts and machining costs of the titled device by a method wherein an insulating material is fixed on the sides of a hole for connecting to an external case and the whole body is resin-sealed excluding a part of this insulating material and the external lead. CONSTITUTION:An insulating hollow screw 19 is inserted into a hole 18 for fixing an external case in a metallic support 16 while a semiconductor chip 20 is directly connected to the metallic supporter 16 through the intermediary of a solder layer 11. On the other hand, a sealing resin 17 is formed so that it may cover the whole body excluding a part of the screw 19 and an external lead 14 extruded from another external lead 15 and the supporter 16. In such a constitution, a semiconductor device fixed to an external case may become an electrically insulated structure since the case and the chip 10 may be electrically insulated through the intermediary of the resin 17 and the screw 19. On the other hand, the part and machine costs may be remarkably cut down due to less number of parts in the internal strcture.

Inventors

• 👤 Masami Matsumura
• 👤 松村　正己

Bibliographic Details