Beveling grinder for wafer

Abstract

Abstract PURPOSE:In the manufacturing process of semiconductor element, to bevel the upper and lower faces by same amount irrespective of the thickness of wafer by controlling such that the wafer such as silicon substrate is grinded not in accordance to the design thickness but the actual thickness. CONSTITUTION:Upper and lower shafts 2, 11 movable up and down while having upper and lower seats 3, 12 for holding a wafer 1 are provided to perform beveling on the upper and lower faces of wafer 1 through a concave grindstone 22. Here a detector (reader) 27 measurable of the displacement of up down motion is provided on the lower shaft 11 to be pressed against the upper shaft 2 to calculate the thickness D2 of wafer 1 on the basis of the output from said detector 27 then the lower face of the seat on the point (I) is set at the referential position to perform positional control of the upper/lower section shafts 2, 11 for receiving the wafer 1. The lower face of the upper seat 3 is positioned at such height where the height (X) of the cross point (I) between the inclined face and the vertical face in the recess of the grindstone 22 is added with (D2-S)/2 (Here S is the setting length of vertical end face EF of the wafer 1) while the wafer 1 is lowered by t-S from the upper face beveling position.

Inventors

• 👤 Hideo Kamikawachi
• 👤 秀夫 上川内

Bibliographic Details