Resin molding device

Abstract

Abstract PURPOSE:To solve problems such as initial investment and waste of time by preventing generation of a flash by providing an elastic film comprising a heat resistance on convex planes of a top force and a bottom force facing each other. CONSTITUTION:The device has the structure in which convex planes of a top force 1 and a bottom force 3 facing each other are coated with an elastic film 11 consisting of Teflon. A lead frame 6 is set between the top force 1 and the bottom force 2 and the resin is poured into a hollow part 3 and a resin body 12 is formed in the semiconductor element to which plural terminals 4... of the lead frame 6 are connected. At molding, the electric film 11 functions so as to seal up the top force 1, the bottom force 2 and the lead frame 6 and prevents a leakage of the resin and to avoid generation of a flash in the terminal of the lead frame 6. As to the material for the elastic film, only substance which comprises a heat resistance is available.

Inventors

• 👤 Masumi Nakama
• 👤 仲摩　真澄

Bibliographic Details