Forming method for bump for connection

Abstract

Abstract PURPOSE:To form the high bump easily on a substrate, on which the bump is to be disposed through a lift-off method by coating a negative type resist film with an opening with a conductor layer and dissolving and removing each resist film. CONSTITUTION:A first positive type resist film 22 is applied on the substrate 21 on which a bump is to be formed, and dried and cured, and the resist film 22 is coated with a first metallic layer 23 of an element such as aluminum. The upper surface of the metallic layer 23 is coated similarly with a second positive type resist film 24 and a second metallic layer 25 of Al. The second metallic layer 25 exposed to an opening section 27 is removed selectively through etching while using a negative type resist film 26 with the opening section 27 as a mask, and the second positive type resist film 24 exposed is exposed selectively, and dissolved and removed by a developer. The surface is coated thickly with a good- conductive metallic conductor layer 29 of indium, etc. The positive type resist films 22, 24 to which the disposing hole 28 is formed are dissolved by a resist exfoliating liquid.

Inventors

• 👤 Shoji Nomura
• 👤 昭司 野村
• 👤 Shusaku Shibata
• 👤 修作 柴田

Bibliographic Details