Semiconductor resin sealing apparatus

Abstract

Abstract PURPOSE:To easily separate the gate and cull after the molding by stacking the top force and bottom force respectively having the cavity for element sealing at the lower and upper surfaces, accommodating molding resin tablet in the cylindrical pot provided at the bottom force and fusing it, and pressing the end of plunger into the guiding path exceeding the interface between the top and bottom forces at the time of transferring the resin tablet into the cavity by lifting it with the plunger. CONSTITUTION:A bottom force 2 having the cylindrical pot 4 facing to the cavity 3A and cull 9 is stacked to the top force 1 of which lower surface a plurality of cavities 3B for sealing semiconductor element and the concave, namely the gate including the cull 9 connected to said cavities. A molding resin 7 is accommodated in the pot 4, it is then lifted by the plunger 6, the resin 7 is heated and fused and is then caused to flow into the cavities 3A and 3B through the cull 9 and the gate 5. In such a structure, the end point of plunger 6 is inserted into the cull 9 making it easy to separate the resin 7 after it is hardened.

Inventors

• 👤 Takao Fujizu
• 👤 隆夫 藤津

Bibliographic Details