Method for spray cleaning

Abstract

Abstract PURPOSE:To obtain the pure wafer or mask with a clean pattern by using both of pure water by spray and that by running water. CONSTITUTION:A rotating sample 1 is subjected to the pure water 3 injected from a spray nozzle 2 and the pure water 5 flowing out from a nozzle 4 for running water. Consequently, a water film of a constant thickness is maintained on a surface of the rotating sample 1 by the pure water 5 flowing out from the nozzle 4 for running water, thereby reducing the impact force of spray by the pure water 3 injected from the spray nozzle 2 applied to a surface of the sample 1. Also, as the water film becomes more thick by the running water, the resist already processed and the dust are included in the water film and are removed from the sample 1 by the centrifugal force produced the rotation. Accordingly, the pure sample 1 with a clean pattern can be obtained.

Inventors

• 👤 Akira Watanabe
• 👤 明 渡辺

Bibliographic Details