Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve the reproducibility and accuracy of the joining of bumps by mounting a slip preventive means to a bump disposing surface. CONSTITUTION:Metallic bumps 3, 5 for the electrode connecting sections of semiconductor chips 1, 2 are disposed. Hook-shaped guide bumps 4 are arranged to the peripheral section of a bump disposing surface for one chip 1. Connecting bumps 6 are disposed to the peripheral section of a bump disposing surface for the other chip 2. The bumps 3, 5, the guide bumps 4 and the connecting bumps 6 consists of indium, etc. as a low melting-point metal. The bumps 3, 5 of the chips 1, 2 are opposed mutually, and face down-bonded. A lateral displacement between the bumps 3, 5 can be prevented because the connecting bumps 6 are touched internally with the guide bumps 4. The guide bumps 4 and the connecting bumps 6 can also be combined as spacers on a joining.

Inventors

• 👤 Shuji Watanabe
• 👤 渡辺　修治

Bibliographic Details