Chemical copper plating solution

Abstract

Abstract PURPOSE:To obtain the titled plating soln. having superior stability and depositing copper at a high rate by adding a compound contg. S to a copper plating soln. contg. N,N,N',N'-tetrakis(2-hydroxypropyl)-ethylenediamine as a complexing agent, a reducing agent and a pH adjusting agent. CONSTITUTION:This chemical copper plating soln. contains a copper salt, a reducing agent, a pH adjusting agent, 1-10 times as much N,N,N',N'-tetrakis-(2- hydroxypropyl)ethylenediamine as the copper salt by mole, and 0.01-10mg/l compound contg. S. An inorg. sulfur compound such as sodium sulfide or silver sulfide or an org. sulfur compound such as 2-mercaptobenzothiazole or 1-allyl-2- thiourea is used as said compound contg. S.

Inventors

• 👤 Osamu Sasaki
• 👤 修 佐々木
• 👤 Yoshihito Kobayashi
• 👤 嘉仁 小林
• 👤 Kunihiro Isori
• 👤 五十里　邦弘

Bibliographic Details