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JPS59120884A Expired / Lapsed JP ⏱️ 0.0 years remaining

Resin sealing construction of circuit block for wrist watch

Assignee: Seiko Epson Corp
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Filing: 1982-12-27
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Granted: —
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Expires: 2002-12-27
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Abstract

Abstract PURPOSE:To enable the injection of a mold resin over an IC surface by drawing a circuit conductor at the part facing an active surface of an IC chip across a hole for injection of a resin overhanging it. CONSTITUTION:A pattern 8 facing the active surface of an IC chip 1 within circuit conductor patterns 3 and 8 drawn over a base film 4 with bumps 2 is drawn across a molding hole 5 overhung it. This prevents the phenomenon that a molding resin 6 becomes hard to flow as injected from the hole 5 otherwise caused when the pattern 8 is drawn not across the hole 5 thereby enabling the injection of the resin 6 over the surface of an IC.

Inventors

  • 👤 Kunio Sakuma
  • 👤 佐久間 国雄

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 11:29
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10W74/10; H10W74/15; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/851; H10W72/853; H10W72/856

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