← Back to Patent Explorer
JPS5896531A Expired / Lapsed JP ⏱️ 0.0 years remaining

Mold for injection molding

Assignee: Individual
•
Filing: 1981-12-02
•
Granted: —
•
Expires: 2001-12-02
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract PURPOSE:To provide an inexpensive mold for the injection molding that can be polished in minutes for obtaining a molded item having an ideal mirror surface, by including a cavity surface of a glass, a packing material consisting of a bundle of metal thin bars or metal thin wires, and an adhesive layer bonding them. CONSTITUTION:The cavity surface 2 has a prescribed size and a prescribed shape, and is made of a polished glass material. The packing material 3 consists of a bundle of the metal wires or thin metal bars 31, and the bundle is fit in a ring-shaped case 32. The adhesive layer 4 consists of an inorganic adhesive the coefficient of thermal expansion of which is approximately the same as that of said glass material of the cavity surface. Though the inorganic adhesive contains a large amount of a solvent (water), the solvent can escape radily outside due to the capillarity through spaces 33 between the metal thin wires or metal thin bars 31 composing the packing material 3. The cross-section of the metal thin wire or metal thin bars 31 may assume any shape such as a circle, a triangle, a rectangle, a polygon, etc.

Inventors

  • 👤 Tokuko Yamamoto
  • 👤 山本 登久子

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 16:26
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/17; B29C45/26; B29C45/37

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag