Polyimide or polyamideimide film having fluorine-treated surface and its bonding

Abstract

Abstract PURPOSE:To make a strong adhesive bond, by heat-bonding a poly(amide)imide film having a fluorine-treated surface to a fluorocarbon resin or a metal. CONSTITUTION:A poly(amide)imide film 1 having a fluorine-treated surface is obtained by contacting a poly(amide)imide film 1 with fluorine gas diluted with an inert gas at below 150 deg.C for at least 1min. The fluorine-treated surface 4 is bonded to a flurocarbon resin 2 or a metal 3 and heat-bonded at a temperature >=260 deg.C and a pressure of 0.1kg/cm<2>.G. EFFECT:To heighten the bonding force of a poly(amide)imide film and to give excellent adhesion to metals and fluorohydrocarbon resins. USE:Wire coatings, etc.

Inventors

• 👤 Mutsusuke Nanba
• 👤 陸祐 難波
• 👤 Shigeyoshi Hayashida
• 👤 林田　成好
• 👤 Tadayuki Maeda
• 👤 前田　忠行

Bibliographic Details