Process and device of wire bonding

Abstract

Abstract PURPOSE:To make the wire bonding highly reliable and efficient making use of laser beam. CONSTITUTION:A pellet 12 made of silicon is fixed to ceramic package 10 by bonding and an aluminum electrode pad 14 and aluminum or gold conductive layer 16 formed on the ceramic package 10 are electrically connected to each other by means of bonding an aluminum wire 18. The front end of optical fiber 28 is inserted into a bonding head 22 to introduce the laser beam from a laser oscillator 26 and the front end is terminated at the lower end of said bonding head 22 radiating the laser beam to aluminum wire 18. Besides an output adjusting device 30 is provided halfway of the optical fiber 28 so as to variably adjust the output of laser beam corresponding to the diameter of the wire 18. The aluminum wire 18, electrode pad 14 and conductive layer 16 are welded with one another by means of laser beam output on the bonding part.

Inventors

• 👤 Minoru Enomoto
• 👤 榎本　実
• 👤 Kazuo Ito
• 👤 一夫 伊藤

Bibliographic Details