Epoxy resin prepreg

Abstract

Abstract PURPOSE:To provide a prepreg excellent in adhesion, heat resistance, and moldability, by impregnating a reinforcement with a resin compsn. contg. an epoxy resin, a specified reaction product of an epoxy resin, 4,4'-diaminodiphenyl sulfone, dicyandiamide and curing accelerator thereof. CONSTITUTION:A reinforcement is impregnated with an epoxy resin compsn. contg. an epoxy resin (A), a reaction product (B) of an epoxy resin with a liq. butadiene-acrylonitrile copolymer having a carboxyl groups at the both terminals 4,4'-dimethydiphenyl sulfone (C), and dicyandiamide and curing accelerator thereof (D). The proportion is 3-30pts.wt. component (B), 20-45pts.wt. component (C), and 0.1-2pts.wt. (D) based on 100pts.wt. component (A). Adhesion of the prepreg at elevated temp. is increasinly lowered when the dicyandiamide is involved below 0.1pts.wt. or above 2pts.wt.

Inventors

• 👤 Takeshi Minamizawa
• 👤 南澤　毅
• 👤 Yasuhisa Nagata
• 👤 康久 永田

Bibliographic Details