Adhesive composition

Abstract

Abstract PURPOSE:The titled composition, containing a polyimide silicone precursor consisting of specific repeating units obtained by reacting a diaminosiloxane with an organic tetrabasic acid dianhydride, etc., capable of firmly bonding a semiconductor element to an external supporting electrode, and having improved heat resistance. CONSTITUTION:A composition containg a polyamide-silicone precursor, obtained by reacting a diaminosiloxane with an organic diamine containing no silicon and an organic tetrabasic acid anhydride, and consisting of 0.1-50mol% repeating units expressed by formulaI(R is bifunctional hydrocarbon; R' is monofunctional hydrocarbon; R'' is tetrafunctional organic group; n is an integer >=1) and 50-99.9mol% repeating units expressed by formula II (R'' is bifunctional organic group which is a residue of an organic diamine containing no silicon) and further preferably an inorganic filler, e.g. silica, or an electrically conductive filler, preferably Ag powder having a maximal particle diameter <5mum, in the case of the required heat dissipation. EFFECT:Reduced cost due to the removal of Au.

Inventors

• 👤 Daisuke Makino
• 👤 大輔 牧野
• 👤 Nintei Sato
• 👤 任廷 佐藤
• 👤 Nobuo Ichimura
• 👤 市村　信雄
• 👤 Shunichiro Uchimura
• 👤 内村　俊一郎

Bibliographic Details