Method and apparatus for inspection of semiconductor element

Abstract

Abstract PURPOSE:To eliminate remedy after mounting and to practice high-density mounting by a method wherein heating is applied from the rear of a probe card and projected electrodes at the upper face are abutted to solder balls on the electrodes of a semiconductor element for melting and connection and after inspection, the solder balls are again melted for partial fusion. CONSTITUTION:Projected electrodes 12 of W with Ni plating of an alumina ceramic made probe card 11 are positioned to the electrodes of a semiconductor substrate 7 and the temperature of the projected electrodes 12 is risen by applying heating from the rear of the card and after exceeding solder melting point, the projected electrodes 12 are abutted to the solder balls 9 on the electrodes of the substrate 7 for connection and heating is stopped. The solder balls will not be melted as far as the bases. A predetermined inspection is performed through a power wire 13 and signal wires 14 contained in the card and heating is done again and heating is stopped when the solder around the electrodes is melted and separated each other. Therefore, the solder on an element will scarcely be decreased and the bases of the solder balls do not melt and undesired heat hysteresis will not be given to the element. In this way, when a substrate like practically used wiring substrate is used for the prober, high-speed inspection is available and with the length of the electrodes 12, tip shape and solder ball diameter selected, solder correction after mounting becomes unnecessary.

Inventors

• 👤 Kazuo Hirota
• 👤 和夫 廣田
• 👤 Masaru Sakaguchi
• 👤 勝 坂口
• 👤 Muneo Oshima
• 👤 大島　宗夫
• 👤 Ichiro Ishi
• 👤 石　一郎

Bibliographic Details