JPS5869052A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Novel laminated board and its molding method
Assignee: Asahi Dow Ltd
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Filing: 1981-10-21
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Granted: —
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Expires: 2001-10-21
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 片岡 紘
- 👤 永原 孝司
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 22:54
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0326
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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