Manufacture of transistor package

Abstract

Abstract PURPOSE:To obtain a package for flip chip having a complete plane by a method wherein dielectric substrates are adhered on the parts other than the protruding part of a metal base having the protruding part, and the protruding part and the surfaces of the substrates are polished as to form the same plane. CONSTITUTION:The metal base 5 is formed, and the dielectric substrates 6 are adhered on the base 5. At this time, the surfaces of the dielectric substrates 6 and the protruding part 51 of the base 5 form not the same plane commonly. When the surfaces thereof are polished in condition that the substrates 6 and the base 5 are adhered, the complete plane can be obtained. Then Cr/Au, for example, is evaporated in a vacuum on the whole of the surfaces, Au plating is performed, and a metallized pattern 7 is formed by the photoengraving process.

Inventors

• 👤 Osamu Ishihara
• 👤 理 石原

Bibliographic Details