Method for removal of resist

Abstract

Abstract PURPOSE:To remoe the resist adhered to a wafer circumference section by a method wherein a resist solvent is supplied to the circumference section of the wafer rotated on a spinner. CONSTITUTION:A container for accommodating a wafer is composed of an upper cup 1 and a lower cup 2. A spinner 4 holding and rotating the wafer 3 is installed by penetrating the lower cup 2. Nozzles 5, 8 for supplying resist are provided by penetrating the cups 1, 2. The wafer 3 applied resist 7 is held on the spinner 4. With a resist solvent supplied toward the resist section adhered to the wafer 3 through the nozzle 5, 8 while rotating the wafer 3, the resist is dissolved and eliminated.

Inventors

• 👤 Susumu Nanko
• 👤 進 南光
• 👤 Koichi Miyamoto
• 👤 浩一 宮本

Bibliographic Details