Manufacture of patterned resist film on substrate

Abstract

Abstract PURPOSE:To manufacture the titled film requiring no processing for development by irradiating electron beams to a fluoroalkyl acrylate (co)polymer film formed on a substrate by a plasma polymn. method. CONSTITUTION:Fluoroalkyl acrylate represented by formulaI(where Rf is 1- 15C perfluoroalkyl or a group having >=1 F atom obtd. by substituting H for >=1 F atom in the perfluoroalkyl; R<1> is H, methyl, ethyl or halogen; and R<2> is a bivalent hydrocarbon residue), e.g., the compound of formula II or III is polymerized or copolymerized with other polymerizable substance such as ethylene, methacrylic acid or vinyl chloride by a plasma polymn. method to form a film of a fluoroalkyl acrylate (co) polymer or a mixture of a fluoroalkyl acrylate homopolymer with a homopolymer of other polymerizable substance on a substrate, and electron beams are irradiated to the film to manufacture the titled film.

Inventors

• 👤 Shuzo Hattori
• 👤 服部　秀三
• 👤 Shinzo Morita
• 👤 慎三 森田
• 👤 Tsuneo Fujii
• 👤 藤井　恒男

Bibliographic Details