Electronic circuit parts

Abstract

Abstract PURPOSE:To avoid disconnections on a circuit, by providing separate bumps for bonding reinforcement which are unnecessary on an electric circuit at four corners of a part and at the position of a substrate corresponded thereto, when the chip-shaped electronic circuit part is bonded to lead patterns provided on the substrate. CONSTITUTION:A plurality of bumps 2 necessary on an electric circuit are respectively formed in the periphery of an IC chip 1, and separate bumps 3 for bonding reinforcement which are unnecessary on the electric circuit are formed at four corners of the chip 1 wherein bumps 2 do not exist. Thereat, the size of the bump 3 can be the same as that of the bump 2 or larger in the area. Thereafter, the bumps 2 of the IC chip 1 are bonded to lead patterns 5 provided on the print wiring substrate 4, and also the bumps 3 are bonded to lead patterns 6 which are unnecessary on an electric circuit. Thus, the electric reliability of the bonding part is improved.

Inventors

• 👤 Kazuhito Ozawa
• 👤 小沢　一仁

Bibliographic Details