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JPS5853384A Expired / Lapsed JP ⏱️ 0.0 years remaining

Laser seam welding machine

Assignee: Toshiba Corp
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Filing: 1981-09-25
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Granted: —
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Expires: 2001-09-25
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Abstract

Abstract PURPOSE:To execute laser seam welding which is excellent in reliability, by pinch-holding a material to be joined, by the upper and lower chips, pressing it, and also horizontally moving a condensing lens of laser light, when seam- welding the material to be joined, by laser light. CONSTITUTION:Onto a tip part 3a of a horizontal arm 3 of a machine frame 1, an upper chip 8 is installed so that the inside can be cooled with water. To the end part of a rocking lever 5 rocked by a cylinder device 7 around an upper supporting point 6 of the machine frame 1, a laser device 4 is installed, and also to the other end 5a, an upper chip 12 is installed. On a lower chip 8, a material 13 to be joined is placed, the tip 5a of the rocking lever 5 is depressed by driving the piston device 7, and the material 13 to be joined is pressed by the upper chip 12. Subsequently, laser light is generated by driving the laser device 4, advanced in a groove provided in the rocking lever, and focused to the junction part of the material 13 to be joined, by a reflector provided in the upper chip 12, and also slid in the horizontal direction by a cylinder device 19, and the material to be joined is seam-welded by a specified length.

Inventors

  • 👤 Toru Saima
  • 👤 亨 斉間

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-27 09:07
CPC Classifications
B; B23; B23K; B23K26/00; B23K26/20; B23K26/21; B23K26/24; B23K26/244; B23K26/14; B23K26/1462

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