Semiconductor device

Abstract

Abstract PURPOSE:To contrive increase in productivity and reduction in production cost of the titled device by a method wherein a semiconductor element and a lead frame are attached to a substrate, a wire-connection is performed, the light transparent region of the internal package is opposed to the element, and a resin sealing work is performed by exposing the end part of the lead frame. CONSTITUTION:The lead frame 21 is fixed on the insulated substrate 20, the semiconductor element 23 is installed on an island 21a using epoxy paste 22, and connected to a lead 21b. The element 23 and the point of the lead 21b are placed in the frame 25 having a hollow part 25a, a light transmitting member 26 having trapezoidal cross-section is installed in such a manner that it will be blocking the hollow part 25a, and the light transmitting member 26, which surrounds the element 23, a hollow frame 25 and the substrate 20 are sealed and formed in one body using a desired resin. According to this constitution, an expensive gold series solder and a ceramic member are unnessary, production cost is reduced, and the element insutallation, wire connection, resin sealing, and cutting and bending of lead frames can be performed automatically, thereby enabling to improve productivity remarkably.

Inventors

• 👤 Takamasa Yamada
• 👤 山田　隆正
• 👤 Hisaharu Sakurai
• 👤 桜井　寿春

Bibliographic Details