Manufacture for semiconductor device

Abstract

Abstract PURPOSE:To expel air bubbles out of solder by a method wherein guides with their surfaces in alignment are provided on a substrate side and, first, the semiconductor device is moved onto the guides after sufficient fitting between the device and the solder and, next, is returned together with some solder attached to its lower side to the prescribed position on the solder, when a semiconductor device is fixed by solder on a substrate placed on a stem. CONSTITUTION:An Mo substrate 3 is fixed secure upon a semiconductor housing substrate 1 constituted of a Cu made stem or the like with silver solder 2 and a semiconductor device 5 is fixedly placed thereon by soldering material 4. In this construction, for the device to be fixed at a prescribed location 7, first, one or several convex guides 6 are located with their height uniform along a side of the substrate 3. The device 5 is temporarily placed at the position 7 on the soldering material 4. Fitting is then performed sufficiently for the removal of as many air bubbles as possible out of the soldering material 4. Then the device 5 is caused to travel along the guides 6 until a side of the device 5 is located over an edge of the substrate 3. After this, the device 5 is placed, together with some soldering material 4 stuck on its rear surface, back to the prescribed position 7 for fixation.

Inventors

• 👤 Haruki Nakazawa
• 👤 中澤　春樹
• 👤 Yoshinori Kinoshita
• 👤 木下　喜順
• 👤 Mutsuo Yagi
• 👤 矢木　睦男

Bibliographic Details