Manufacture of hybrid integrated circuit

Abstract

Abstract PURPOSE:To permit high reliability bonding by etching only by a method wherein a wiring circuit is formed by etching alminum-copper clad foil and an alminum circuit is also formed by additional ethcing and next the circuit and a semiconductor are fixed by alminum lead wires by an ultrasonic vibration method. CONSTITUTION:The drawing shows that alminum-copper clad foil 8 are stacked so that the copper foil 4 may position on the surface of an insulator layer 2. Next, the alminum-copper clad foil 8 form a wiring circuit for both the layer 2 and the foil 4. Then, etching is done and furthermore alkali etching is applied to a metal substrate 1, the layer 2, and a part of an alminum circuit 3' to expose a copper circuit 4' and after placing a semiconductor, or a resistor or the like on said copper circuit 4' through solder 7, the semiconductor 6 and the aluminum cirucit 3' are fixed by alminum lead wires 5 by an ultrasonic vibration method.

Inventors

• 👤 Shinichiro Asai
• 👤 新一郎 浅井
• 👤 Kazuo Kato
• 👤 和男 加藤
• 👤 Tatsuo Nakano
• 👤 辰夫 中野

Bibliographic Details