Cooling structure for lsi package

Abstract

Abstract PURPOSE:To improve the cooling capacity of an LSI package by forming a heat transfer unit of bimetal structure on an LSI, allowing it to deform at the temperature rising time and to be pressurized to a cooling module. CONSTITUTION:An LSI package is placed on a package substrate 2, two transfer units 3 of bimetal structure are fixed in U shape in section, and a cooling module 7 is interposed between frames 8 at a gap from the unit 3. Liquid coolant 4 is supplied at 5 to the module and is exhausted. Most of the heat is flowed through the unit 3 to the module 7, the unit 3 is deformed by the temperature rise of the LSI, is then pressurized to the module 7, thereby decreasing the thermal resistance, the pressing force is increased proportionally to the temperature rise, thereby further decreasing the thermal resistance, and the temperature of the unit can be maintained constantly, thereby improving the cooling capacity of the package.

Inventors

• 👤 Tsuneaki Tajima
• 👤 田島　恒明

Bibliographic Details