Novel polyepoxy compound

Abstract

Abstract NEW MATERIAL:A polyepoxy compound expressed by the formula (R is H or CH3; X is H, Cl, Br or I). EXAMPLE:4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl. USE:A raw material, useful as a varnish, sealing material, adhesive, laminating or molding material, having a melting point <=100 deg.C before the curing and a heat deformation temperature >=190 deg.C after the curing with a curing agent, and capable of giving a cured article having high heat resistance and improved mechanical properties. PROCESS:A methylated bishydroxybiphenyl, e.g. 4,4'-bishydroxy-3,3',5,5'-tetramethylbiphenyl, is reacted with an epihalohydrin, etc. to give the compound expressed by the formula. The resultant compound is, if necessary, mixed with a general-purpose polyepoxy compound or a diluent, and then a curing agent, e.g. an acid anhydride, polyamine or polyphenol, and cured under heating to give the above-mentioned cured article.

Inventors

• 👤 Kaoru Kanayama
• 👤 薫 金山

Bibliographic Details