Semiconductor device and manufacture thereof

Abstract

Abstract PURPOSE:To perform a perfect connection for the titled device by a method wherein, when the pad provided on the back side of a ceramic container with a sealed IC element and the pad which was formed on a wiring substrate are interconnected, the connection is performed corresponding to said pads through the intermediary of an insulated plate with a hole in which solder was pressed in. CONSTITUTION:When a plurality of pads 11, obtained by printing using Au paste, which were provided on the back side of a ceramic container 10 wherein an IC element 12 was placed and the similar pad 21 formed on the wiring substrate 10 opposing to said pads 11 are interconnected, the following procedures are performed. Penetrated holes are bored on a heat-resisting resin sheet 1 of polyimide or the like, solder balls 3 are pressed into the holes, and an insulating plate, whereon a half circle of these balls 3 is protruded on the front and back sides, is prepared. Then, this insulating plate is inserted between pads 11 and 12 while a positioning is being performed with the balls 3, and the pads 11 and 12 are interconnected by fusing the balls 3 performing thermo-pressure welding. Through these procedures, the interconnecting work can be performed very easily.

Inventors

• 👤 Nobuhiko Mizuo
• 👤 水尾　允彦

Bibliographic Details