Wafer grinder

Abstract

Abstract PURPOSE:To miniaturize a wager grinder and obviate the development of a hair crack on a wafer, by installing a rough grinding wheel and a finish grinding wheel on a common bed in parallel with each other, while making only one side of them movable at will. CONSTITUTION:Having adjusted the position of a grinding wheel 22 for finishing in advance in this way moving a common bed 18 in an up-and-down motion so as to bring a wafer 3 into a thickness of h2 upon finish grinding while a material wafer 3a is in a thickness of h0, a fine elevating rib 24 is rotated in order to cause wafer thickness to be adjusted to h1 upon rough grinding so that the position of a grinding wheel 20 for rough grinding is adjusted. In this state, when a motor 19 for wheel rotation is driven whereby both wheels 20 and 22 are rotated and simultaneously moved toward the wafer 3, both 20 and 22 grind two wafers 3 for rough and finish, respectively, with their paths traced in different directions each.

Inventors

• 👤 Takashi Sano
• 👤 高志 佐野
• 👤 Atsushi Kato
• 👤 淳 加藤

Bibliographic Details