Preparation of resin sealed type semiconductor device

Abstract

Abstract PURPOSE:To prevent generation of burrs along the lead frame at the circumference of the resin mold by preventing leak of resin at the lead frame insertion groove on the die matching surface in the sealing process. CONSTITUTION:The compressive insulation tapes 14, 15 are provided at the upper and lower portions of the lead frame 5 crossing the lead frame insertion groove 13 of the mold matching surfaces 11, 12 before the mold tightening, these tapes 14, 15 are bonded to the circumference of the lead frame 5 at the time of mold tightening, simultaneously these tapes 14, 15 are pressed to be inserted into the insertion groove 13 of the lead frame of die, thereby the fine gap between the lead frame inserting groove 13 and the lead frame 5 can be shielded perfectly. At the time of mold tightening, the tapes 14, 15 deform due to the mold tightening pressure and are inserted into any fine gap. Therefore, this insertion groove 13 is perfectly shield even when the shape of cross section of the lead frame 5 does not match the shape of lead frame insertion groove 13 of the die. Since the insertion groove 13 is perfectly shield as explained above, any ''burrs'' are not generated at the circumference of the mold.

Inventors

• 👤 Yoshimasa Kudo
• 👤 工藤　好正

Bibliographic Details