Semiconductor device

Abstract

Abstract PURPOSE:To prevent the isolation of a lead frame from resin of a lead and a tab lead by increasing the contacting area of the resin with the lead frame at part of the resin bonding surfaces of the lead and the tab lead and forming uneven surface such as a coining capable of engaging both in a shearing direction. CONSTITUTION:A lead frame 10 has a tab 11 of square shape formed at the center, leads 12 disposed with inner parts around the tab 11, and tab leads 13 connected through a frame (not shown) to the tab 11. A semiconductor element pellet 14 is secured onto the tab 11, and a wire 16 is connected between the pad 15 and the lead 12. This structure integrally molds to seal with the resin 17 the inner part of the lead, the tab 11, the pellet 14, the wire 16. On the other hand, a coining 18 is performed on the partial surface of the inner parts of the leads 12 and the tab lead 13, thereby forming the uneven surface on the surface. The coining 18 is formed by rollers or a press, and particularly in case of the press, it is performed simultaneously with the punching of the lead frame.

Inventors

• 👤 Hiroshi Mikino
• 👤 三木野　博
• 👤 Wahei Kitamura
• 👤 北村　和平
• 👤 Susumu Okikawa
• 👤 進 沖川

Bibliographic Details