Semiconductor device having multi-layer wirings

Abstract

Abstract PURPOSE:To protect chips from probing and mechanical impact during measurement by forming element region just under the bonding pad and also by forming an extruded electrode at the bonding pad. CONSTITUTION:An extruded electrode 91 is formed on the bonding pad of chip providing multi-layered wirings and an extruded electrode 92 is formed also at the center of chip. With such structure, a first wiring layer 12 is formed on an element 10 through an insulating film 11 and a first insulating layer 13 is also formed. The second wiring layer 15 is connected to the first wiring layer through a concrete hole 14 formed on the first insulating layer. A protection film 16 is formed on the second wiring layer 15, a bonding pad 17 is arranged on the protection film 16 and extruded electrode 9 is formed on the pad. Since the extruded electrode 9 is formed, a deposition stress increases. Therefore such stress is alleviated by using a heat proof high polymer material having flexibility such as polyimide as an inter-layer insulating film 13 and a highly reliable device can be realized.

Inventors

• 👤 Yukichi Kobayashi
• 👤 小林　佑吉

Bibliographic Details