Semiconductor device

Abstract

Abstract PURPOSE:To relax the thermal stress of solder resistance, etc. then prevent the infiltration of water via a tab suspension lead and thus contrive the improvement of moisture resistance by a method wherein the end parts of the tab suspension lead which are exposed outside a package are covered with Si resin or heat resistant adhesive material such as other resin. CONSTITUTION:After a semiconductor element 4 is fixed on a tab 3 supported by the tab suspension lead 2 of a lead frame 1, the electrode of this semiconductor element 4 and the internal end of leads 5 which project the internal end in the periphery of the tab 3 are connected by wires 6, and thereafter the semiconductor element 4, the wires 6, and the internal end parts of the leads 5 are resin-molded and covered with the package 7. The unnecessary part of the lead frame is cut and removed. Besides, the external end parts of the leads 5 projecting out from the package 7 are bent downward into an in-line type. The tab suspension lead 2 is cut at the edge parts of the package 7. The end parts of the tab suspension lead 2 which are exposed on the outer peripheral surface of the package 7 are covered with heat resistant adhesive material such as Si resin, and the interface end between the tab suspension lead 2 and the package 7 which serves as the infiltration port for moisture is covered with the coating body 8.

Inventors

• 👤 Shunichiro Shigematsu
• 👤 重松　俊一郎
• 👤 Shigeo Ishii
• 👤 石井　重雄
• 👤 Kazuhiro Tsurumaru
• 👤 鶴丸　和弘
• 👤 Kazuo Shimizu
• 👤 一男 清水

Bibliographic Details