Dry etching device

Abstract

Abstract PURPOSE:To effectively cool a sample supporting mechanism without reducing the power for supporting the sample and thus contrive to speed up etching without causing resist deterioration, by providing an elastic member of good thermal conductivity which is pressed and pinched by the supporting mechanism and a cathode at the time of contact-fixing the sample on the cathode by the supporting mechanism. CONSTITUTION:The sample 2 is mounted on an insulation film 31 of Mylar or Kapton, etc. on the water-cooled cathode 3. The elastic member 41 constituted of e.g. Si rubber is interposed between the sample supporting mechanism 14 constituted of alumite and the cathode 3 resulting in the mechanical adhesion between the sample 2 and the cathode 3, and simultaneously the supporting mechanism 14 is cooled by the elastic member 41 of good thermal conductivity. By this constitution, the problem of bending during etching and further resist deterioration is completely solved. For the elastic member 41, rubbers are most effective.

Inventors

• 👤 Haruo Okano
• 👤 晴雄 岡野
• 👤 Takashi Yamazaki
• 👤 隆 山崎
• 👤 Yasuhiro Horiike
• 👤 靖浩 堀池

Bibliographic Details