Purifying method for wafer

Abstract

Abstract PURPOSE:To easily separate and remove unnecessary substances adhering to a wafer therefrom the charging them with electrons by plasma discharge. CONSTITUTION:A wafer 1 to which dust 2 adheres is placed on an electrode 4 coated with an insulator 5. Ar is introduced into a vessel 10 and exhausted therefrom, and plasma discharge is generated between the electrode 4 and an electrode 3 by a high-frequency power source 7. Then the dust 2 is charged with electrons. Next, when negative voltage is applied to the electrode 4 by a DC power source 9, the dust 2 is separated from the wafer 1, and thus the dust, which has been hard to remove in the conventional method, can be removed with ease.

Inventors

• 👤 Naomichi Abe
• 👤 阿部　直道
• 👤 Moritaka Nakamura
• 👤 守孝 中村

Bibliographic Details