Semiconductor device

Abstract

Abstract PURPOSE:To disable the measurement of monitoring elements in chips after cutting and prevent leakage of secrets in manufacturing technique, by a method wherein at least one of pads of monitoring elements is formed on adjacent chip. CONSTITUTION:Transistor Q in a chip 22 has gate electrode pad in an adjacent chip 23, and pads P5, P7 of resistors R1, R2 are in the adjacent chip 23. The transistor Q and resistors R1, R2 can be measured at wafer state, but not after cutting into chips as monitoring elements. Threby manufacturing process technique cannot be known by third parties.

Inventors

• 👤 Tomio Nakano
• 👤 中野　富男
• 👤 Yoshihiro Takemae
• 👤 義博 竹前
• 👤 Masao Nakano
• 👤 正夫 中野
• 👤 Norihisa Tsuge
• 👤 柘植　典久
• 👤 Takeshi Ohira
• 👤 大平　壮

Bibliographic Details