Hybrid integrated circuit

Abstract

Abstract PURPOSE:To facilitate formation by shaping a recognition pattern for wire bonding onto a wiring conductor or an insulating film formed to a concave section molded by the wiring conductor. CONSTITUTION:When the recognition patterns 10 consisting of conductor films are shaped onto the wiring conductors 7 on a ceramic substrate 6, the concave sections among the wiring conductors 7 are burined with black crystallized glass 8, black crystallized glass 9 is further stacked and the patterns 10 are formed. Accordingly, the surfaces of the patterns 10 are flattened, the diffused reflection of beams is not generated, and the minute patterns can easily by shaped.

Inventors

• 👤 Eiji Miyajima
• 👤 宮嶋　栄志

Bibliographic Details