Surface acoustic wave device

Abstract

Abstract PURPOSE:To obtain a surface acoustic wave device having a lamination structure in which plural elements are incorporated into a single device without increasing the area of the upper surface of a substrate, by laminating plural surface coustic wave elements via plates. CONSTITUTION:Reed screen type electrodes 6 are set on the upper surface of a substrate for surface acoustic wave elements 41, 42 and 43 respectively. A terminal 62 is soldered to a terminal extracting part 61 of the electrode 6. Laminating plates 51 and 52 of both-terminal supporting structure are set between the elements 41 and 42 as well as between 42 and 43 respectively. Thus an element lamination is formed. In this case, it is not necessary to use an equal material for the substrates of the elements 41-43. Otherwise the cut angle and propagating direction of the surface wave may be changed possibly among the substrates of the same material.

Inventors

• 👤 Akira Miyajima
• 👤 宮島　明

Bibliographic Details