Curable resin composition

Abstract

Abstract PURPOSE:A resin composition to be quickly cured by irradiation of ionizing radiation, having resistance to scuffing, comprising a reaction product of specific amounts of a polyisocyanate compound, isocyanuric acid derivative, and radically polymerizable compound containing hydroxyl group. CONSTITUTION:(A) One or more polyisocyanate compounds (e.g., 2,4-tolylene diisocyanate, etc.) are subjected to a urethane forming reaction with (B) 0.05- 1.90 equivalent isocyanutric acid derivative shown by the formula (X is 1-5C alkylene or a group obtained by substituting OH for H of alkylene; R1 and R2 are acryloyl or methacryloyl or H; n is 1-20) based on 1 equivalent isocyanate group of the component A, and (C) 0.10-0.95 equivalent one or more radically polymerizable compounds[e.g., 2-hydroxyethyl-(meth)acrylate, etc.]at 20-120 deg.C (preferably 40-100 deg.C), to give an isocyanutric ring-containing radically polymerizable compound (film-forming component) modified with urethane.

Inventors

• 👤 Osamu Maruyama
• 👤 修 丸山
• 👤 Hideyoshi Ishikawa
• 👤 石川　英宜
• 👤 Nobuo Takahashi
• 👤 信夫 高橋

Bibliographic Details