Optical connection between mother board and package

Abstract

Abstract PURPOSE:To perform large-capacity transmission between packages and a mother board, by multiplexing and converting transmitted signals from the package into optical signals, and thus performing signal transfer through the mother board provided with an optical waveguide. CONSTITUTION:An electric signal generated on a package 1 is multplexed by a multiplexing circuit 3, and the multiplexed signal is converted into an optical signal by a module 5 which includes an electrooptic converting circuit and a light emitting element array. The optical signal is transmitted to an optical waveguide 9 formed on a mother board 1 through a connector 7, and then transmitted to another package, etc. A signal from another package, etc., are passed through the optical waveguide 8 on the board 1 and a connector 8 and led to a module 6 which includes an optoelectric converting circuit and a photodetecting element array, so that the input signal is converted into an electric signal. The electric signal is demultiplexed by a demultiplexing circuit 4 and sent into the package 1. Thus, an increase in the number of terminals of each electric connector is eliminated and large-capacitance transmission is performed.

Inventors

• 👤 Takashi Kurokawa
• 👤 隆志 黒川
• 👤 Norio Takato
• 👤 高戸　範夫
• 👤 Toshio Takahane
• 👤 高羽　敏男
• 👤 Yasuhiko Kasukawa
• 👤 粕川　泰彦

Bibliographic Details