Cooling device for semiconductor manufacturing apparatus table

Abstract

Abstract PURPOSE:To simplify the shape of the recess provided in the lower end surface of a semiconductor manufacturing apparatus table and to increase the heat exchange area, by forming a water chamber communicating with a drain bore by the table and an insulating plate, and disposing a sprinkling pipe provided with sprinkling nozzles on the outer periphery of the water chamber. CONSTITUTION:A table 12 is provided in its lower end surface with a recess 22 by machining which, together with an insulating plate 13, defines a water chamber under the state where the table 12 and the insulating plate 13 are buried in a table holder 14. The water chamber communicates with a drain bore 17 through a drain port 23 bored in the insulating plate 13. A sprinkling pipe 25 having sprinkling nozzles 24 formed in its side surface opposing to the drain bore 7 is disposed on the outer periphery of the water chamber. The sprinkling pipe 25 and a water supply pipe 20 are connected through water pipes 26. When the wafer mounted on the wafer holder is subjected to a plasma etching treatment, the table 12 is excellently cooled by the cooling water which is supplied to the sprinkling pipe 25 through the water supply pipe 20 and the water pipes 26 and sprinkled into the water chamber from the sprinkling nozzles 24 to circulate through the water chamber and is then discharged through the drain port 23 and the drain bore 17.

Inventors

• 👤 Koichiro Noda
• 👤 野田　耕一郎
• 👤 Norio Kanai
• 👤 金井　謙雄
• 👤 Katsuyoshi Kudo
• 👤 勝義 工藤

Bibliographic Details